According to IMARC Group’s latest report, titled “E-Beam Wafer Inspection System Market: Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026,” the global e-beam wafer inspection system market reached a value of US$ 461 Million in 2020. Looking forward, the market is expected to grow at a CAGR of around 21% during 2021-2026.
We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
E-beam wafer inspection system is a fabrication tool for semiconductors that utilizes electron beam scanning of integrated circuit (IC) components or wafers. It identifies the defects in wafers and scans small sections of a die to determine specific, hard-to-detect, systematic and random defects. The inspection system compares the wafer with the image of the adjacent dies to determine the defected coordinates. The technique is widely used in manufacturing compact gadgets, smartphones, laptops, and tablets. E-beam wafer inspection system is also deployed in lithographic qualification, wafer dispositioning, and reticle quality optimization.
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The expanding consumer electronics sector has led to the rising adoption of semiconductors in manufacturing specialized devices and consumer electronics, thereby augmenting the demand for e-beam wafer inspection system. Additionally, the emergence of advanced automobile components, such as airbag controls, global positioning systems (GPS), anti-lock braking systems (ABS), and digital display devices, is also driving the market for the inspection system. They also aid in upgrading automated driving and collision detection technologies, thereby positively influencing the market growth. Moreover, several technological advancements have led to the introduction of more-efficient multi-beam inspection systems that reduce the overall time required for mass production
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List of Key Companies Covered in this Market Report:
- Aerotech Inc.
- Applied Materials Inc.
- ASML Holding N.V.
- Hitachi Ltd.
- KLA-Tener Corporation
- Lam Research Corporation
- Nanotronics Imaging Inc.
- NXP Semiconductors N.V. (Qualcomm Incorporated)
- Renesas Electronics Corporation
- Synopsys Inc.
- Taiwan Semiconductor
- Teledyne Technologies.
The report has segmented the market on the basis of resolution, application, end use and geography.
Breakup by Resolution:
- Less than 1 nm
- 1 nm to 10 nm
- More than 10 nm
Breakup by Application:
- Defect Imaging
- Lithographic Qualification
- Bare Wafer OQC/IQC
- Wafer Dispositioning
- Reticle Quality Inspection
- Inspector Recipe Optimization
Breakup by End Use:
- Communication Devices
- Consumer Electronic Equipments
- Automotive Parts
Breakup by Geography:
- North America (U.S. & Canada)
- Europe (Germany, United Kingdom, France, Italy, Spain, Russia, and Others)
- Asia Pacific (China, India, Japan, South Korea, Indonesia, Australia, and Others)
- Latin America (Brazil, Mexico)
- Middle East & Africa
Key highlights of the report:
- Market Performance (2015-2020)
- Market Outlook (2021- 2026)
- Porter’s Five Forces Analysis
- Market Drivers and Success Factors
- SWOT Analysis
- Value Chain
- Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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